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Comb Positioning Insert for BGA IC Test Socket
  • Comb Positioning Insert for BGA IC Test SocketComb Positioning Insert for BGA IC Test Socket
  • Comb Positioning Insert for BGA IC Test SocketComb Positioning Insert for BGA IC Test Socket

Comb Positioning Insert for BGA IC Test Socket

In the field of semiconductor testing, BGA (Ball Grid Array) packaged chips impose extremely stringent requirements on the positioning accuracy of test sockets. This product is the core positioning comb insert for BGA IC test sockets, fabricated from high-performance ASSAB VIKING mold steel. Adopting the overall wire EDM finishing process after pre-assembly, it delivers superior array uniformity and minimal accumulated tolerance. It is widely deployed in BGA test sockets, burn-in sockets and automated semiconductor test systems. Processing specification for ASSAB VIKING material: 0.05mm ultra-fine wire wire EDM machining; total accumulated error across 24 pitches ≤ 0.003 mm.

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Product Description


Technical Parameters – Comb Positioning Insert for BGA IC Test Socke

tMaterial: ASSAB VIKING

Application: BGA IC Test Socket

Array Structure: 11 × 24

Pitch: 1.00 mm

Comb Tooth Thickness: 0.38 mm

Top Micro-tooth Dimension: 0.215 × 0.38 mm

Tooth Height: 3.4 mm

Single Tooth Dimensional Tolerance: ±0.002 mm

Cumulative Error Over 24 Pitches: 0.003 mm

Wire EDM Wire Diameter: 0.05 mm

Inspection Equipment: KEYENCE IM-1220 


Core Function in BGA Test Socket

This comb insert performs chip positioning, guiding and retention, ensuring precise alignment between the BGA solder ball array and test probes.As the packaging density of chips continues to rise, test sockets impose increasingly stringent requirements on pitch consistency and micro-structure machining capability. The positioning comb insert has become one of the core components that determine test stability.


Overall Wire EDM Machining Solution After Pre-Assembly

Traditional processes adopt single-piece machining followed by assembly, which easily generates cumulative errors.Process adopted by Xincheng Precision:Finish machining via single-tooth grinding machine → Mount onto custom fixture → Full pre-assembly & locking → Final forming with 0.05 mm fine wire WEDM

This process effectively eliminates sources of assembly errors, restricting the cumulative pitch error of 24 pitches within 0.003 mm. It also represents the core technical highlight of this case.



Why Choose ASSAB VIKINGASSAB VIKING

It features both high wear resistance and high toughness.

Advantages include:

• Excellent wear resistance

• Superior resistance to edge chipping

• Dimensional stability after heat treatment

• Suitable for micro thin-wall structures

• Long service life

For micro-tooth structures of 0.215 mm, it can effectively reduce the risks of edge chipping and tooth breakage.


Why Adopt 0.05 mm Fine Wire WEDM

This project requires internal radii within R0.03 mm.

1. Process necessity: The 0.05 mm wire diameter can meet the requirement of R0.03 mm internal radii.

2. Material compatibility: High-hardness ASSAB VIKING steel is ideal for low-energy precision electrical discharge machining.

3. Edge chipping prevention: Reduces the risk of damage to micro teeth.

4. Dimensional stability: Ensures consistent microstructures.

5. Superior surface quality: Delivers finer surface finish with multiple trim cuts.





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