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              Comb Positioning Insert for BGA IC Test Socket
              • Comb Positioning Insert for BGA IC Test SocketComb Positioning Insert for BGA IC Test Socket
              • Comb Positioning Insert for BGA IC Test SocketComb Positioning Insert for BGA IC Test Socket

              Comb Positioning Insert for BGA IC Test Socket

              In the field of semiconductor testing, BGA (Ball Grid Array) packaged chips impose extremely stringent requirements on the positioning accuracy of test sockets. This product is the core positioning comb insert for BGA IC test sockets, fabricated from high-performance ASSAB VIKING mold steel. Adopting the overall wire EDM finishing process after pre-assembly, it delivers superior array uniformity and minimal accumulated tolerance. It is widely deployed in BGA test sockets, burn-in sockets and automated semiconductor test systems. Processing specification for ASSAB VIKING material: 0.05mm ultra-fine wire wire EDM machining; total accumulated error across 24 pitches ≤ 0.003 mm.

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              Product Description


              Technical Parameters – Comb Positioning Insert for BGA IC Test Socke

              tMaterial: ASSAB VIKING

              Application: BGA IC Test Socket

              Array Structure: 11 × 24

              Pitch: 1.00 mm

              Comb Tooth Thickness: 0.38 mm

              Top Micro-tooth Dimension: 0.215 × 0.38 mm

              Tooth Height: 3.4 mm

              Single Tooth Dimensional Tolerance: ±0.002 mm

              Cumulative Error Over 24 Pitches: 0.003 mm

              Wire EDM Wire Diameter: 0.05 mm

              Inspection Equipment: KEYENCE IM-1220 


              Core Function in BGA Test Socket

              This comb insert performs chip positioning, guiding and retention, ensuring precise alignment between the BGA solder ball array and test probes.As the packaging density of chips continues to rise, test sockets impose increasingly stringent requirements on pitch consistency and micro-structure machining capability. The positioning comb insert has become one of the core components that determine test stability.


              Overall Wire EDM Machining Solution After Pre-Assembly

              Traditional processes adopt single-piece machining followed by assembly, which easily generates cumulative errors.Process adopted by Xincheng Precision:Finish machining via single-tooth grinding machine → Mount onto custom fixture → Full pre-assembly & locking → Final forming with 0.05 mm fine wire WEDM

              This process effectively eliminates sources of assembly errors, restricting the cumulative pitch error of 24 pitches within 0.003 mm. It also represents the core technical highlight of this case.



              Why Choose ASSAB VIKINGASSAB VIKING

              It features both high wear resistance and high toughness.

              Advantages include:

              • Excellent wear resistance

              • Superior resistance to edge chipping

              • Dimensional stability after heat treatment

              • Suitable for micro thin-wall structures

              • Long service life

              For micro-tooth structures of 0.215 mm, it can effectively reduce the risks of edge chipping and tooth breakage.


              Why Adopt 0.05 mm Fine Wire WEDM

              This project requires internal radii within R0.03 mm.

              1. Process necessity: The 0.05 mm wire diameter can meet the requirement of R0.03 mm internal radii.

              2. Material compatibility: High-hardness ASSAB VIKING steel is ideal for low-energy precision electrical discharge machining.

              3. Edge chipping prevention: Reduces the risk of damage to micro teeth.

              4. Dimensional stability: Ensures consistent microstructures.

              5. Superior surface quality: Delivers finer surface finish with multiple trim cuts.





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